Grain-boundary sliding in a TiAl alloy with fine-grained duplex microstructure during 750 °C creep (bibtex)

by D. Peter, G.B. Viswanathan, M.F.-X. Wagner, G. Eggeler

@Article{Peter2009a,
  author   = {Peter, D. and Viswanathan, G.B. and Wagner, M.F.-X. and Eggeler, G.},
  journal  = {Materials Science and Engineering A},
  title    = {{Grain-boundary sliding in a {TiAl} alloy with fine-grained duplex microstructure during 750 °C creep}},
  year     = {2009},
  issn     = {09215093},
  pages    = {359--363},
  volume   = {510-511},
  abstract = {Constant-load creep experiments at a temperature of 750 °C and a nominal stress of 300 MPa were conducted on a fine-grained Ti–45Al–5Nb–0.2B–0.2C (in at.%) alloy with a duplex microstructure. Microstructures before and after creep (accumulated strain: 9.6%) were analyzed using scanning and transmission electron microscopy (SEM and TEM). TEM analysis after creep indicates that the individual microstructural constituents of the fine duplex microstructure, namely, the equiaxed γ and the lamellar α\textsubscript{2}/γ colonies, undergo varying degrees of deformation and develop various substructures. Lamellar grains deform by dislocation creep. They showclear evidence for dislocation and twin activity. Incontrast, only fewdislocations are found in the equiaxed grains.We showthat the regions with small equiaxed ? grains, representing 65–75vol.% of the microstructure, deform by grain-boundary sliding.},
  doi      = {10.1016/j.msea.2008.11.071},
  isbn     = {0921-5093},
  keywords = {Creep, Fine-grained duplex microstructure, Gamma titanium aluminide, Grain-boundary sliding},
}